CWB/12-44 - 在半导体切槽上移除带倒角键合半导体的工具
FUNCTION(S)
Cut / saw; Remove the outer sheath; Crimp connectors; Work on the outer sheath; Remove / work on the shield; Remove the outer semi-conductor; Remove the insulation; Shape the insulation; Tool kits overview; Maintain / hang / fix cables; Grounding
DIAMETER
ø12 - 44 mm
ø0.472 - 1.732 in
TO DO WHAT
The CWB/12-44 enables the user to remove the bonded semicon with a chamfer on the semiconductor cutback
PRODUCT BENEFITS
No silicon needed
Fine tuning of the blade with a 'click' for each 1/10 mm
Low roughness over insulation
No Clamp stoper needed
THICKNESS CAPACITY
1,8 mm / 0,071 in
ANGLE OF THE CHAMFER ON THE SEMICONDUCTOR
13°
REMAINING LENGTH OF THE SEMICONDUCTOR
25mm / 0,984 in
Products
功能
切割/锯：移除外部护套；压接连接器；处理外护套；移除/操作防护罩；移除外部半导体；移除绝缘层；塑造绝缘；工具包概述；维护/悬挂/固定电缆；接地
直径：
12 - 44毫米 0.472 - 1.732英寸
CWB/12-44使用户能够在半导体切槽上移除带倒角的粘合半导体
产品优势：无需硅
每1/10毫米“咔哒”一声，对刀片进行微调
绝缘表面粗糙度低
不需要夹钳停止器
厚度容量1.8毫米/0.071英寸
倒角角度13度
剩余长度为25毫米/0.984英寸
